A new report has surfaced online suggesting that Apple has yet another trick up its sleeve to make the next generation iPhone, the iPhone 7, much more thinner than the former generation.
Despite being only three months since Cupertino unveiled the two latest additions to its iPhone lineup, the iPhone 6S and 6S Plus, the rumor mill is being already flooded with rumors regarding the next installment, which is ostensibly set for launch sometime during the third quarter of 2016 – during WWDC 2016 in June or a separate iPhone launch event in September.
Moreover, according to a research conducted by HSBC – acquired by Apple Insider -, Apple and Samsung will be no longer shaking hands when it comes to the iPhone’s CPU, as it appears that TSMC – Chinese semiconductor manufacturer -, has struck a deal with Cupertino, thus securing full control over the production of the A10 chip, which will be incorporated in the iPhone 7.
When it comes to the thickness of the handset, TSMC’s manufacturing procedure will allow a stack of chips to be mounted on top of each other and then directly to the motherboard, that way reducing the vertical height of the board, essentially resulting to a significantly thinner smartphone.
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The authority of the particular intel is enforced by another report that emerged a few days ago, claiming that Apple is allegedly considering to dismiss the 3.5mm headphone jack from the iPhone, which has been accompanying the device since the inception of the series, in favor of thinness. A respective lighting headphones import will assumingly replace the former one.
In addition to making the iPhone thinner, a piece of info that has been sitting in the rumor mill for months now, is Apple’s purported plans of removing the iconic physical home button, which will be supplanted by the recently implemented 3D Touch feature.
Besides featuring a slimmer design, the removal of the home button would also clean up screen size, allowing the iPhone to sport a larger display as well.
Via: Apple Insider
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